Request Information Request Quote Add To Cart
This package is 1.10 mm ±0.03 mm L, 1.10 mm ±0.03 mm W, package thickness is 0.45 mm ±0.05 mm. One center pad with APS contact
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Name

 N/A DFN

Number of Input/Output (I/O)

 N/A 9

Pitch

 N/A 0.4 mm0.0157 in

Array

 N/A 3 on 2, 1 on 2, plus 1

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 1.1 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Width (W)

 N/A 1.1 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

 N/A 0.45 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 13.46 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets