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This package is a 3.30 mm ±0.03 mm L, 1.35 mm ±0.03 mm W x 0.75 mm ±0.05 T. The pads are 0.25 mm ±0.05 mm L x 0.20 mm +0.05 mm/- 0.00 mm W. There are 2 sets of 8 pads on the long side. Plus 1 center pad.
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Name

 N/A TDFN

Number of Input/Output (I/O)

 N/A 17

Pitch

 N/A 0.4 mm0.0157 in

Array

 N/A 8 on 2, plus 1

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 3.3 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Width (W)

 N/A 1.35 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

 N/A .75 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 13.97 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets