Request Information Request Quote Add To Cart
Pads are 0.37 mm ±0.05 mm L x 1.00 mm +0.05/-0.00 mm W OFFSET by .127 ±0.05 mm. The package thickness is 3.41 mm ±0.30 mm and the body is 7.00 ±0.05 mm SQ.
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Name

 N/A QFN

Number of Input/Output (I/O)

 N/A 12

Pitch

 N/A 1.8 mm0.071 in

Array

 N/A 3 on 4

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 7.00 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Width (W)

 N/A 7.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

 N/A 3.41 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.3 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 21.84 mm

Overall Socket Footprint Width (W)

 N/A 18.03 mm

Overall Socket Footprint Height (H/T)

 N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets