Request Information Request Quote Add To Cart
This package is 6.00 mm ±0.05 mm SQ x 0.30 mm ±0.05 mm (+) 2.00 mm Max Thick. Substate is 0.30 ± 0.05 mm thcik. Large center 3.0 mm SQuare protruding cap on top of package (2.00 mm Max Ht.)
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Type

 N/A QFN

Number of Package Leads (I/O)

 N/A 21

Pitch

 N/A 1 mm0.0394 in

Array

 N/A 6 on 2, 4 on 2, plus 1

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Package Dimensions

Internal Socket Package Body Length (L)

 N/A 6.00 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Width (W)

 N/A 6.00 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

 N/A 2.30 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 21.84 mm

Overall Socket Footprint Width (W)

 N/A 18.03 mm

Overall Socket Footprint Height (H/T)

 N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets