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This package is 8.00 ±0.05 mm L x 6.00 ±0.05 mm W x 0.75 ±0.05 mm T. 18 pads are 0.50 ±0.10 mm L x 0.50 ±0.05 mm W. The center pad is 3.60 ±0.10 mm L x 5.80 ±0.10 mm W. No connection to center pad.
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Name

 N/A QFN

Number of Input/Output (I/O)

 N/A 18

Pitch

 N/A 1 mm0.0394 in

Array

 N/A 8 on 2, 1 on 2

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 8 mm

Internal Socket Package Body Width (W)

 N/A 6.00 mm

Internal Socket Package Body Height (H/T)

 N/A .75 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 23.88 mm

Overall Socket Footprint Width (W)

 N/A 19.3 mm

Overall Socket Footprint Height (H/T)

 N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets