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This package is 4.10 mm ±0.0.05 mm L x 3.20 mm ±0.05 mm W X 1.15 mm ±0.05 mm T. Pads are 0.34 mm +0.05 mm L and offset by 0.10 mm ±0.05 mm.
Unit of Measure

Specifications

Minimum Order

 N/A 1

Brands

 N/A Loranger International Corp.

Package Name

 N/A DFN

Number of Input/Output (I/O)

 N/A 15

Pitch

 N/A Multi

Array

 N/A 6 on 1, 8 on 1

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Mounting Ears

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 4.1 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Width (W)

 N/A 3.2 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

 N/A 1.15 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 20.57 mm

Overall Socket Footprint Width (W)

 N/A 12.95 mm

Overall Socket Footprint Height (H/T)

 N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets