Item # 150SQ 196L6617, 196 Input/Output (I/O) and 1 Millimeter (mm) Pitch Land Grid Array (LGA) Socket On Loranger International Corp.

Ceramic package with a FlipChip die has a 1.12 mm T plus an additional 0.90 mm clearance for the FlipChip die that is 7.14 mm L x 5.71 mm W

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A LGA
Number of Input/Output (I/O)	N/A 196
Pitch	N/A 1 mm0.039 in
Array	N/A 14 x 14
Number of Rows	N/A 14
Number of Columns	N/A 14
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 15 mm
Internal Socket Package Body Width (W)	N/A 15 mm
Internal Socket Package Body Height (H/T)	N/A 2.02 mm

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 16.51 mm

N/A

Brands