Item # 170SQ 228LAPKB, 228 Input/Output (I/O) and 1 Millimeter (mm) Pitch Land Grid Array (LGA) Socket On Loranger International Corp.

Package thickness TBD includes a "push to the datum corner" spring design and high-performance/high-current contacts.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A LGA
Number of Input/Output (I/O)	N/A 228
Pitch	N/A 1 mm0.039 in
Array	N/A 16 x 16, D
Number of Rows	N/A 16
Number of Columns	N/A 16
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 17.00 mm
Internal Socket Package Body Width (W)	N/A 17.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.77 mm

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 16.94 mm

N/A

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