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Ceramic package with one surface-mount capacitor in the underside of cover (1.81 mm T) over the FlipChip-mounted silicon to the pads. 3 orientation balls stand below the pads another 0.022"/0.025" but are not electrically connected.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A LGA

Number of Input/Output (I/O)

 N/A 388

Pitch

 N/A 1.27 mm0.05 in

Array

 N/A 20 x 20, D

Number of Rows

 N/A 20

Number of Columns

 N/A 20

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 27.00 mm

Internal Socket Package Body Width (W)

 N/A 27.00 mm

Internal Socket Package Body Height (H/T)

 N/A 1.81 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 45.97 mm

Overall Socket Footprint Width (W)

 N/A 38.61 mm

Overall Socket Footprint Height (H/T)

 N/A 16.51 mm

Additional Information

N/A

  • Optional Heat Sink
  • Low Profile and Small Footprint
  • Zero-insertion-force Surface Mount Design / Solder-Free