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High-performance plunger-type contact makes connection to latest photon/electron application. Overall pkg thickness is 4.79mm ±0.20mm. Comes with a 5-fin aluminum heatsink mounted to socket cover.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A Ball Grid Array (BGA)/ Chip Scale Package (CSP)

Number of Input/Output (I/O)

 N/A 143

Pitch

 N/A 1.000 mm0.039 in

Array

 N/A 12 x 12 D

Number of Rows

 N/A 12

Number of Columns

 N/A 12

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Type

 N/A Optical Transceiver

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 13 mm

Internal Socket Package Body Width (W)

 N/A 13 mm

Internal Socket Package Body Height (H/T)

 N/A 4.79 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 45.97 mm

Overall Socket Footprint Width (W)

 N/A 38.61 mm

Overall Socket Footprint Height (H/T)

 N/A 59.44 mm