Print Back
This Package has an overall thickness of 0.575 mm ±0.05 mm. 0.40 mm pitch, full 3 x 3 array. Ball diameter 0.25 mm
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 9

Pitch

N/A 0.40 mm0.016 in

Array

N/A 3 x 3

Number of Rows

N/A 3

Number of Columns

N/A 3

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Mounting

N/A Through-Hole

Ball Diameter

N/A 0.25 mm

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 1.248 mm

Internal Socket Package Body Width (W)

N/A 1.248 mm

Internal Socket Package Body Height (H/T)

N/A 0.575 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 13.59 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free