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This Package is 1.33 mm ±0.03 mm L x 0.83 mm ± 0.03 mm W. Package thickness is 0.58 mm ± 0.05 mm. The ball arrangement is one ball in each of the 4 corners of the Package and 1 ball in the center / interstial pitch is 0.5 mm. Interstitial pitch.
Unit of Measure

Specifications

Brands

Loranger International Corp.

Package Name

BGA/CSP

Number of Input/Output (I/O)

5

Pitch

0.50 mm0.02 in

Array

2 on 2, plus 1, Interstitial

Number of Rows

3

Number of Columns

3

Kelvin Type

false

Socket Style

Clamshell

Mounting

Through-Hole

Lead Time

2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

1.33 mm

Internal Socket Package Body Length (L) Tolerance

±0.03 mm

Internal Socket Package Body Width (W)

0.83 mm

Internal Socket Package Body Width (W) Tolerance

±0.03 mm

Internal Socket Package Body Height (H/T)

0.58 mm

Internal Socket Package Body Height (H/T) Tolerance

±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

26.67 mm

Overall Socket Footprint Width (W)

19.05 mm

Overall Socket Footprint Height (H/T)

11.18 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free