Item # 013012009J6617, 9 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Loranger International Corp.
817 Fourth Ave.
Warren, PA 16365
Asia and North America West Phone: (408) 727-4234
Europe and North America East Phone: (814) 723-2250
Email: sales@loranger.com
Website: www.loranger.b2bdd.website

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This Package is 1.322 mm ±0.03 mm L x 1.296 mm ± 0.03 mm W. Package thickness is 0.575 mm ± 0.05 mm. Ball Dia 0.25 mm ± 0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 9
Pitch	N/A 0.40 mm0.0157 in
Array	N/A 3 x 3
Number of Rows	N/A 3
Number of Columns	N/A 3
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.25 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 1.322 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.03 mm
Internal Socket Package Body Width (W)	N/A 1.296 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.03 mm
Internal Socket Package Body Height (H/T)	N/A 0.575 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 13.46 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free