Item # 015SQ 009J6618A, 9 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

THE SOCKET IS DESIGNED FOR MAXIMUM POPULATION OF 9 CONTACTS AND IS FULLY POPULATED. REFERENCE SHANGHAI DWG. #MOSFET, PROVIDED BY FAIRCHILD. (CONVERT TO AN APS DESIGN AT LIC'S EXPENSE. FUTURE ORDERS WITH APS CONTACTS WILL BE AT THE ABOVE PRICES AND A 6 WEEK DELIVERY.)

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A MOSFET BGA
Number of Input/Output (I/O)	N/A 9
Pitch	N/A 0.50 mm0.02 in
Array	N/A 3 x 3
Number of Rows	N/A 3
Number of Columns	N/A 3
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 1.5 mm
Internal Socket Package Body Width (W)	N/A 1.5 mm
Internal Socket Package Body Height (H/T)	N/A .75 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.18 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free

Specifications

Brands

Package Name

Number of Input/Output (I/O)

Pitch

Array

Number of Rows

Number of Columns

Kelvin Type

Socket Style

Mounting

Lead Time

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

Internal Socket Package Body Width (W)

Internal Socket Package Body Height (H/T)

Overall Socket Area

Overall Socket Footprint Length (L)

Overall Socket Footprint Width (W)

Overall Socket Footprint Height (H/T)

Additional Information