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This Package has an overall thickness of 0.5 +0.00/-0.08 mm. Solder ball height is 0.00 - 0.05 mm; solder ball diameter is 0.25 ±0.05 mm.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 16

Pitch

N/A 0.50 mm0.02 in

Array

N/A 4 x 4

Number of Rows

N/A 4

Number of Columns

N/A 4

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Ball Diameter

N/A 0.25 mm

Ball Diameter Tolerance

N/A ±0.05 mm

Ball Height

N/A 0.00 to 0.05 mm

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 2.00 mm

Internal Socket Package Body Width (W)

N/A 2.00 mm

Internal Socket Package Body Height (H/T)

N/A 0.5 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A -0.08 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 11.43 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free