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Micro BGA package with two rows of 5 solder balls per row. APS contacts
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 10

Pitch

N/A Multi

Array

N/A 2 x 5

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 2.54 mm

Internal Socket Package Body Width (W)

N/A 1.14 mm

Internal Socket Package Body Height (H/T)

N/A .75 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 11.43 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free