Loranger International Corp.
Loranger International Corp.
817 Fourth Ave.
Warren, PA 16365
Asia and North America West Phone: (408) 727-4234
Europe and North America East Phone: (814) 723-2250
Email: sales@loranger.com
Website: www.loranger.b2bdd.website
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This Micro BGA Package is 2.67 mm ±0.05 mm W x 2.75 mm ±0.05 mm L x 0.65 mm ±0.050 mmH. Ball DIA .033 mm ±0.05 mm, Ball Height 0.24 ±0.01 mm
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 25

Pitch

 N/A 0.50 mm0.02 in

Array

 N/A 5 x 5

Number of Rows

 N/A 5

Number of Columns

 N/A 5

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Ball Diameter

 N/A 0.033 mm

Ball Diameter Tolerance

 N/A ±0.05 mm

Ball Height

 N/A 0.24 mm

Ball Height Tolerance (±)

 N/A 0.01 mm

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 2.75 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Width (W)

 N/A 2.67 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

 N/A .65 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 11.43 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free