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This package is 3.50 mm ±0.05 mm SQ x 1.15 mm ±0.05 mm T. The ball dia is 0.89 mm ±0.09 mm. With center GLOB 2.40 mm max dia. & 0.85 mm max height
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 4

Pitch

N/A 2.5 mm0.098 in

Array

N/A 2 x 2

Number of Rows

N/A 2

Number of Columns

N/A 2

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Ball Diameter

N/A 0.89 mm

Ball Diameter Tolerance

N/A ±0.09 mm

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 3.5 mm

Internal Socket Package Body Length (L) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Width (W)

N/A 3.5 mm

Internal Socket Package Body Width (W) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

N/A 1.15 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 11.18 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free