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Package fully-populated to 80 balls with only "C3" ball missing in 9 x 9 array. Similar to FlipChip.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 80

Pitch

N/A 0.50 mm0.02 in

Array

N/A 9 x 9, D

Number of Rows

N/A 9

Number of Columns

N/A 9

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 5.00 mm

Internal Socket Package Body Width (W)

N/A 5 mm

Internal Socket Package Body Height (H/T)

N/A 1.00 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 16.51 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free