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Micro BGA package with center depopulation area. Standard Micro Spring contacts.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 190

Pitch

N/A 0.65 mm0.0256 in

Array

N/A 20 x 17, D

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Mounting

N/A Through-Hole

Ball Diameter

N/A Micro BGA package with center depopulation area. Standard Micro Spring contacts. mm

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 14 mm

Internal Socket Package Body Width (W)

N/A 12.00 mm

Internal Socket Package Body Height (H/T)

N/A .65 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 37.34 mm

Overall Socket Footprint Width (W)

N/A 26.67 mm

Overall Socket Footprint Height (H/T)

N/A 16.76 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free