Item # 230SQ 233B6617, 233 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Loranger International Corp.
817 Fourth Ave.
Warren, PA 16365
Asia and North America West Phone: (408) 727-4234
Europe and North America East Phone: (814) 723-2250
Email: sales@loranger.com
Website: www.loranger.b2bdd.website

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The overall Package thickness is 2.13 mm ±0.20 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 233
Pitch	N/A 1.27 mm0.05 in
Array	N/A 17 x 17, D
Number of Rows	N/A 17
Number of Columns	N/A 17
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 23.00 mm
Internal Socket Package Body Width (W)	N/A 23.00 mm
Internal Socket Package Body Height (H/T)	N/A 2.13 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 42.16 mm
Overall Socket Footprint Width (W)	N/A 33.53 mm
Overall Socket Footprint Height (H/T)	N/A 16.94 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free