Item # 270SQ 256B1618B, 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Since handler robotics adjust to the various Package thicknesses, there is no Package thickness specified. However, deflection of the floating plate should be designed and progra mmed on the handler for a nominal 0.018"

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 256
Pitch	N/A 1.27 mm0.05 in
Array	N/A 20 x 20, D
Number of Rows	N/A 20
Number of Columns	N/A 20
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 27.00 mm
Internal Socket Package Body Width (W)	N/A 27.00 mm
Internal Socket Package Body Height (H/T)	N/A 1.8 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 45.97 mm
Overall Socket Footprint Width (W)	N/A 38.61 mm
Overall Socket Footprint Height (H/T)	N/A 6.99 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free

Specifications

Brands

Package Name

Number of Input/Output (I/O)

Pitch

Array

Number of Rows

Number of Columns

Kelvin Type

Socket Style

Lead Time

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

Internal Socket Package Body Width (W)

Internal Socket Package Body Height (H/T)

Overall Socket Area

Overall Socket Footprint Length (L)

Overall Socket Footprint Width (W)

Overall Socket Footprint Height (H/T)

Additional Information