Print Back
This Package is an Ompak design that is 2.33 mm T.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 665

Pitch

N/A 1.27 mm0.05 in

Array

N/A 31 x 31, D

Number of Rows

N/A 31

Number of Columns

N/A 31

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Mounting

N/A Through-Hole

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 40.00 mm

Internal Socket Package Body Width (W)

N/A 40.00 mm

Internal Socket Package Body Height (H/T)

N/A 2.25 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 60.71 mm

Overall Socket Footprint Width (W)

N/A 53.34 mm

Overall Socket Footprint Height (H/T)

N/A 25.91 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free