Print Back
Package is 2.50 mm ±0.03 mm L, 2.00 mm ±0.03 mm W, 0.55 mm ±0.05 mm T. Pads are .25 mm +.05 mm/ -0.00 mm L,.20 mm +.05 mm/ -0.00 mm W.
Unit of Measure

Specifications

Minimum Order

N/A 1

Brands

N/A Loranger International Corp.

Package Name

N/A QFN

Number of Input/Output (I/O)

N/A 16

Pitch

N/A 0.4 mm0.0157 in

Array

N/A 5 on 2, 3 on 2

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 2.5 mm

Internal Socket Package Body Length (L) Tolerance

N/A ±0.03 mm

Internal Socket Package Body Width (W)

N/A 2.00 mm

Internal Socket Package Body Width (W) Tolerance

N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

N/A 0.55 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 13.46 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets