Print Back
Device pad width is 0.20 mm ±0.05; length is 0.30 ±0.05 mm. One APS contact to center pad.
Unit of Measure

Specifications

Minimum Order

1

Brands

Loranger International Corp.

Package Name

QFN

Number of Input/Output (I/O)

13

Pitch

0.4 mm0.0157 in

Array

3 on 4, plus 1

Kelvin Type

false

Socket Style

Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

2.5 mm

Internal Socket Package Body Width (W)

2.00 mm

Internal Socket Package Body Height (H/T)

0.55 mm

Overall Socket Area

Overall Socket Footprint Length (L)

26.67 mm

Overall Socket Footprint Width (W)

19.05 mm

Overall Socket Footprint Height (H/T)

13.46 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets