Print Back
The overall package thickness is 1.40 mm ±0.10 mm. Pad width is 0.57 mm ±0.10 mm and pad length is 1.00 mm ±0.025 mm.
Unit of Measure

Specifications

Minimum Order

N/A 1

Brands

N/A Loranger International Corp.

Package Name

N/A Oscar Module

Number of Input/Output (I/O)

N/A 21

Pitch

N/A 1 mm0.039 in

Array

N/A 7 on 2, 3 on 2, plus 1

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 7.5 mm

Internal Socket Package Body Width (W)

N/A 5.5 mm

Internal Socket Package Body Height (H/T)

N/A 1.4 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 21.84 mm

Overall Socket Footprint Width (W)

N/A 15.24 mm

Overall Socket Footprint Height (H/T)

N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets