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This package is 4.50 mm ±0.05 L x 3.50 mm ±0.05 mm W. There are 9 pads on each of the long sides and 3 pads on each of the width sides. The pads are 0.45 mm ±0.05 mm AT364L x 0.25 mm +0.05 mm/-0.00 mm. Thickness is 0.55 mm ±0.05 mm.
Unit of Measure

Specifications

Minimum Order

N/A 1

Brands

N/A Loranger International Corp.

Package Name

N/A Laminated Plastic

Number of Input/Output (I/O)

N/A 24

Pitch

N/A 0.5 mm0.02 in

Array

N/A 3 on 2, 9 on 2

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 4.5 mm

Internal Socket Package Body Length (L) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Width (W)

N/A 3.5 mm

Internal Socket Package Body Width (W) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

N/A 0.55 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 19.05 mm

Overall Socket Footprint Width (W)

N/A 14.99 mm

Overall Socket Footprint Height (H/T)

N/A 18.54 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets