Print Back
This package 7.00 mm ±0.05 mm SQ. Pads are 0.325±0.025 mm W x 0.60 mm + 0.15/- 0.10 mm. Overall package thickness is 0.85 mm/1.00 mm. There are 11 pads on each side of the four sides.
Unit of Measure

Specifications

Minimum Order

N/A 1

Brands

N/A Loranger International Corp.

Package Name

N/A MLF2

Number of Input/Output (I/O)

N/A 44

Pitch

N/A 0.5 mm0.02 in

Array

N/A 11 on 4

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 7.00 mm

Internal Socket Package Body Length (L) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Width (W)

N/A 7.00 mm

Internal Socket Package Body Width (W) Tolerance

N/A ±0.05 mm

Internal Socket Package Body Height (H/T)

N/A 0.925 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 21.84 mm

Overall Socket Footprint Width (W)

N/A 18.03 mm

Overall Socket Footprint Height (H/T)

N/A 18.8 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets