Print Back
package is 25.40 ±0.05 mm L x 19.05 ±0.05 mm W x 3.02 ±0.05 mm T. 4 pads are 6.99 ±0.05 mm L x 3.68 ±0.05 mm W located on one shorter side. Opposite shorter side are 4 pads 2.03 ±0.05 mm L x 1.78 ±0.05 mm W and 2 pads are 2.67 ±0.05 mm L x 1.91 ±0.05 mm W. 4 pads located on both the longer sides of the package are 1.78 ±0.05 mm L x 2.03 ±0.05 mm W.
Unit of Measure

Specifications

Minimum Order

N/A 1

Brands

N/A Loranger International Corp.

Package Name

N/A QFN

Number of Input/Output (I/O)

N/A 18

Pitch

N/A Multi

Array

N/A 4 on 3, 6 on 1

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 25.4 mm

Internal Socket Package Body Width (W)

N/A 19.05 mm

Internal Socket Package Body Height (H/T)

N/A 3.02 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 34.29 mm

Overall Socket Footprint Width (W)

N/A 37.34 mm

Overall Socket Footprint Height (H/T)

N/A 19.81 mm

Additional Information

N/A

  • 0.22 mm Pitch and Greater
  • Dual Row QFN Socket Options Available
  • Non-Magnetic Socket Options Available
  • Accurate, Tightly-controlled Package Fit
  • Optional Heat Sink and Case Contacts
  • PTH or Compression Mount Contacts
  • Optional "Heat Pipe" to Printed Circuit Board
  • Zero-insertion-force
  • 1,300+ ClamShell and Open Top QFN Sockets