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Peripherally populated pads. Two studs mounted to top of package heat-spreader which is 0.167" (4.24 mm) ±0.005" T plus studs 0.276" high. For similar LGA package with 1.00 mm pitch, P8 depopulated 32 x 32 array and pad dimension is 0.80 mm square should use P/N 350SQ 767L6618A
Unit of Measure

Specifications

Brands

Loranger International Corp.

Package Name

LGA

Number of Input/Output (I/O)

767

Pitch

1 mm0.039 in

Array

32 x 32, D

Number of Rows

32

Number of Columns

32

Kelvin Type

false

Socket Style

Clamshell

Mounting

Through-Hole

Lead Time

2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

35.00 mm

Internal Socket Package Body Width (W)

35.00 mm

Internal Socket Package Body Height (H/T)

11.24 mm

Overall Socket Area

Overall Socket Footprint Length (L)

55.63 mm

Overall Socket Footprint Width (W)

48.26 mm

Overall Socket Footprint Height (H/T)

25.91 mm

Additional Information

N/A

  • Optional Heat Sink
  • Low Profile and Small Footprint
  • Zero-insertion-force Surface Mount Design / Solder-Free