Print Back
Module has circuitry and chips on both sides of ceramic substrate. 36-pad contacts are numbered around edge of substrate.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A ABB HAFO AB

Number of Input/Output (I/O)

N/A 36

Pitch

N/A 1.02 mm0.04 in

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 18.54 mm

Internal Socket Package Body Width (W)

N/A 12.19 mm

Internal Socket Package Body Height (H/T)

N/A 2.39 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 41.40 mm

Overall Socket Footprint Width (W)

N/A 52.32 mm

Overall Socket Footprint Height (H/T)

N/A 19.81 mm