This Package is 1.33 mm ±0.03 mm L x 0.83 mm ± 0.03 mm W. Package thickness is 0.58 mm ± 0.05 mm. The ball arrangement is one ball in each of the 4 corners of the Package and 1 ball in the center / interstial pitch is 0.5 mm. Interstitial pitch.
Unit of Measure

Specifications

Brands

N/A Loranger International Corp.

Package Name

N/A BGA/CSP

Number of Input/Output (I/O)

N/A 5

Pitch

N/A 0.50 mm0.02 in

Array

N/A 2 on 2, plus 1, Interstitial

Number of Rows

N/A 3

Number of Columns

N/A 3

Kelvin Type

N/A false

Socket Style

N/A Clamshell

Mounting

N/A Through-Hole

Lead Time

N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

N/A 1.33 mm

Internal Socket Package Body Length (L) Tolerance

N/A ±0.03 mm

Internal Socket Package Body Width (W)

N/A 0.83 mm

Internal Socket Package Body Width (W) Tolerance

N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

N/A 0.58 mm

Internal Socket Package Body Height (H/T) Tolerance

N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

N/A 26.67 mm

Overall Socket Footprint Width (W)

N/A 19.05 mm

Overall Socket Footprint Height (H/T)

N/A 11.18 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free