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This Package is 1.33 mm ±0.03 mm L x 0.83 mm ± 0.03 mm W. Package thickness is 0.58 mm ± 0.05 mm. The ball arrangement is one ball in each of the 4 corners of the Package and 1 ball in the center / interstial pitch is 0.5 mm. Interstitial pitch.
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A BGA/CSP

Number of Input/Output (I/O)

 N/A 5

Pitch

 N/A 0.50 mm0.02 in

Array

 N/A 2 on 2, plus 1, Interstitial

Number of Rows

 N/A 3

Number of Columns

 N/A 3

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 1.33 mm

Internal Socket Package Body Length (L) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Width (W)

 N/A 0.83 mm

Internal Socket Package Body Width (W) Tolerance

 N/A ±0.03 mm

Internal Socket Package Body Height (H/T)

 N/A 0.58 mm

Internal Socket Package Body Height (H/T) Tolerance

 N/A ±0.05 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 26.67 mm

Overall Socket Footprint Width (W)

 N/A 19.05 mm

Overall Socket Footprint Height (H/T)

 N/A 11.18 mm

Additional Information

N/A

  • Low Profile and Small Footprint
  • Zero-insertion-force
  • Surface Mount Design / Solder-Free