Item # 020SQ 016J6617, 16 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Package has an overall thickness of 0.5 +0.00/-0.08 mm. Solder ball height is 0.00 - 0.05 mm; solder ball diameter is 0.25 ±0.05 mm.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 16
Pitch	N/A 0.50 mm0.02 in
Array	N/A 4 x 4
Number of Rows	N/A 4
Number of Columns	N/A 4
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.25 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Ball Height	N/A 0.00 to 0.05 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 2.00 mm
Internal Socket Package Body Width (W)	N/A 2.00 mm
Internal Socket Package Body Height (H/T)	N/A 0.5 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A -0.08 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.43 mm

N/A

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