Item # 027026025J6617, 25 Input/Output (I/O) and 0.50 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This Micro BGA Package is 2.67 mm ±0.05 mm W x 2.75 mm ±0.05 mm L x 0.65 mm ±0.050 mmH. Ball DIA .033 mm ±0.05 mm, Ball Height 0.24 ±0.01 mm

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 25
Pitch	N/A 0.50 mm0.02 in
Array	N/A 5 x 5
Number of Rows	N/A 5
Number of Columns	N/A 5
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Ball Diameter	N/A 0.033 mm
Ball Diameter Tolerance	N/A ±0.05 mm
Ball Height	N/A 0.24 mm
Ball Height Tolerance (±)	N/A 0.01 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 2.75 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Width (W)	N/A 2.67 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Height (H/T)	N/A .65 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.43 mm

N/A

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