Item # 035SQ 004B6617, 4 Input/Output (I/O) and 2.5 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

This package is 3.50 mm ±0.05 mm SQ x 1.15 mm ±0.05 mm T. The ball dia is 0.89 mm ±0.09 mm. With center GLOB 2.40 mm max dia. & 0.85 mm max height

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 4
Pitch	N/A 2.5 mm0.098 in
Array	N/A 2 x 2
Number of Rows	N/A 2
Number of Columns	N/A 2
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Ball Diameter	N/A 0.89 mm
Ball Diameter Tolerance	N/A ±0.09 mm
Lead Time	N/A 2 to 4 week

Internal Socket Package Body Length (L)	N/A 3.5 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Width (W)	N/A 3.5 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.05 mm
Internal Socket Package Body Height (H/T)	N/A 1.15 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.05 mm

Overall Socket Footprint Length (L)	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 11.18 mm

N/A

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