Item # 140120190U6617, 190 Input/Output (I/O) and 0.65 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket On Loranger International Corp.

Request Information Request Quote Add To Cart

Micro BGA package with center depopulation area. Standard Micro Spring contacts.

Unit of Measure

Specifications | Internal Socket Area (Package Dimensions) | Overall Socket Area | Additional Information

Specifications

Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 190
Pitch	N/A 0.65 mm0.0256 in
Array	N/A 20 x 17, D
Kelvin Type	N/A false
Socket Style	N/A Clamshell
Mounting	N/A Through-Hole
Ball Diameter	N/A Micro BGA package with center depopulation area. Standard Micro Spring contacts. mm
Lead Time	N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)	N/A 14 mm
Internal Socket Package Body Width (W)	N/A 12.00 mm
Internal Socket Package Body Height (H/T)	N/A .65 mm

Overall Socket Area

Overall Socket Footprint Length (L)	N/A 37.34 mm
Overall Socket Footprint Width (W)	N/A 26.67 mm
Overall Socket Footprint Height (H/T)	N/A 16.76 mm

Additional Information

N/A

Low Profile and Small Footprint
Zero-insertion-force
Surface Mount Design / Solder-Free