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Peripherally populated pads. Two studs mounted to top of package heat-spreader which is 0.167" (4.24 mm) ±0.005" T plus studs 0.276" high. For similar LGA package with 1.00 mm pitch, P8 depopulated 32 x 32 array and pad dimension is 0.80 mm square should use P/N 350SQ 767L6618A
Unit of Measure

Specifications

Brands

 N/A Loranger International Corp.

Package Name

 N/A LGA

Number of Input/Output (I/O)

 N/A 767

Pitch

 N/A 1 mm0.039 in

Array

 N/A 32 x 32, D

Number of Rows

 N/A 32

Number of Columns

 N/A 32

Kelvin Type

 N/A false

Socket Style

 N/A Clamshell

Mounting

 N/A Through-Hole

Lead Time

 N/A 2 to 4 week

Internal Socket Area (Package Dimensions)

Internal Socket Package Body Length (L)

 N/A 35.00 mm

Internal Socket Package Body Width (W)

 N/A 35.00 mm

Internal Socket Package Body Height (H/T)

 N/A 11.24 mm

Overall Socket Area

Overall Socket Footprint Length (L)

 N/A 55.63 mm

Overall Socket Footprint Width (W)

 N/A 48.26 mm

Overall Socket Footprint Height (H/T)

 N/A 25.91 mm

Additional Information

N/A

  • Optional Heat Sink
  • Low Profile and Small Footprint
  • Zero-insertion-force Surface Mount Design / Solder-Free