Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Burn-In and Test Sockets
- 0.22 mm Pitch and Greater
- Accommodates Package Height Variations
- Non-Magnetic Socket Options Available
- Accurate, Tightly-controlled Package Fit
- Contacts Connect Solder ball to Board Pad
- Optional Heat Sink
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Pitch (mm)
Pitch (in)
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Mounting
Item # |
Item Name |
Package Type |
Number of Package Leads (I/O) |
Pitch |
List Price |
|---|---|---|---|---|---|
| 270SQ 225B6617 /Asset/Socket_BGA.jpg | N/A 225 Input/Output (I/O) and 1.5 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 225 | Pitch N/A 1.5 mm0.059 in | $281.87 |
| 270SQ 228J6618A /Asset/Socket_BGA.jpg | N/A 368 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 368 | Pitch N/A 1 mm0.039 in | $751.04 |
| 270SQ 256B1618B /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 270SQ 256B6617 /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618A /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618B /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618D /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618E /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618F /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618G /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 270SQ 256B6618H /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $383.33 |
| 270SQ 256B6618I /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $319.54 |
| 270SQ 256B6618J /Asset/Socket_BGA.jpg | N/A 256 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 256 | Pitch N/A 1.27 mm0.05 in | $159.87 |
| 270SQ 272B6617 /Asset/Socket_BGA.jpg | N/A 272 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 272 | Pitch N/A 1.27 mm0.05 in | $338.95 |
| 270SQ 272B6618A /Asset/Socket_BGA.jpg | N/A 272 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 272 | Pitch N/A 1.27 mm0.05 in | $338.95 |
| 270SQ 272B6618B /Asset/Socket_BGA.jpg | N/A 272 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 272 | Pitch N/A 1.27 mm0.05 in | $338.95 |
| 270SQ 272M6617 /Asset/Socket_BGA.jpg | N/A 272 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 272 | Pitch N/A 1.27 mm0.05 in | $458.28 |
| 270SQ 280B6617 /Asset/Socket_BGA.jpg | N/A 280 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 280 | Pitch N/A 1.27 mm0.05 in | $348.66 |
| 270SQ 292B6617 /Asset/Socket_BGA.jpg | N/A 292 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 292 | Pitch N/A 1.27 mm0.05 in | $363.24 |
| 270SQ 292B6618A /Asset/Socket_BGA.jpg | N/A 292 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 292 | Pitch N/A 1.27 mm0.05 in | $363.24 |
| 270SQ 296B6617 /Asset/Socket_BGA.jpg | N/A 296 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 296 | Pitch N/A 1.27 mm0.05 in | $368.09 |
| 270SQ 300B6617 /Asset/Socket_BGA.jpg | N/A 300 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 300 | Pitch N/A 1.27 mm0.05 in | $364.25 |
| 270SQ 300B6618A /Asset/Socket_BGA.jpg | N/A 300 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 300 | Pitch N/A 1.27 mm0.05 in | $364.25 |
| 270SQ 316B6617 /Asset/Socket_BGA.jpg | N/A 316 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 316 | Pitch N/A 1.27 mm0.05 in | $392.36 |
| 270SQ 316B6618A /Asset/Socket_BGA.jpg | N/A 316 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 316 | Pitch N/A 1.27 mm0.05 in | $392.36 |

