Loranger International Corp. - Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

0.22 mm Pitch and Greater
Accommodates Package Height Variations
Non-Magnetic Socket Options Available
Accurate, Tightly-controlled Package Fit
Contacts Connect Solder ball to Board Pad
Optional Heat Sink

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Unit of Measure

Items	006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket List Price $70.61 Add To Cart Request Quote	007SQ 004J6617 4 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket List Price $83.00 Add To Cart Request Quote	007SQ 004J6618A 4 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket List Price $20.83 Add To Cart Request Quote	008008005J6617 5 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket List Price $58.83 Add To Cart Request Quote	008SQ 004J6617 4 Input/Output (I/O) and 0.40 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket List Price $20.84 Add To Cart Request Quote
Description	N/A Device is 0.650 mm ±0.020 mm x 0.440 mm ±0.020 mm with a thickness of 0.29 mm ±0.03 mm. Pitches are: 0.23 mm and 0.22 mm	N/A This Package is 0.77 mm ±0.03 mm SQ, overall thickness of 0.45 mm ±0.05 mm. 0.40 mm pitch, full 2 x 2 array. Ball diameter 0.23 mm	N/A This Package is 0.76 mm ±0.03 mm SQ, overall thickness of 0.6 mm ±0.05 mm. 0.40 mm pitch, full 2 x 2 array. Ball diameter 0.23 mm	N/A This Package is 0.840 mm x 0.860 mm ±0.03 mm, overall thickness of 0.34 mm ±0.05 mm. 0.40 mm pitch, Interstitial 3 x 3array. Ball diameter 0.16 mm	N/A This Package is 0.816 mm ±0.03 mm SQ, overall thickness of 0.575 mm ±0.05 mm. 0.40 mm pitch, full 2 x 2 array. Ball diameter 0.25 mm
Minimum Order	N/A	N/A 1	N/A	N/A	N/A
Brands	N/A Loranger International Corp.
Package Name	N/A BGA/CSP
Number of Input/Output (I/O)	N/A 6	N/A 4	N/A 4	N/A 5	N/A 4
Pitch	N/A Multi 0.22 mm0.23 mm	N/A 0.40 mm0.0157 in	N/A 0.40 mm0.0157 in	N/A 0.40 mm0.0157 in	N/A 0.40 mm0.0157 in
Internal Socket Package Body Length (L)	N/A 0.65 mm	N/A 0.77 mm	N/A 0.76 mm	N/A 0.84 mm	N/A 0.816 mm
Internal Socket Package Body Length (L) Tolerance	N/A ±0.02 mm	N/A ±0.03 mm	N/A ±0.03 mm	N/A ±0.03 mm	N/A ±0.03 mm
Internal Socket Package Body Width (W)	N/A 0.44 mm	N/A 0.77 mm	N/A 0.76 mm	N/A 0.86 mm	N/A 0.816 mm
Internal Socket Package Body Width (W) Tolerance	N/A ±0.02 mm	N/A ±0.03 mm	N/A ±0.03 mm	N/A ±0.03 mm	N/A ±0.03 mm
Internal Socket Package Body Height (H/T)	N/A 0.29 mm	N/A 0.45 mm	N/A 0.6 mm	N/A 0.34 mm	N/A 0.575 mm
Internal Socket Package Body Height (H/T) Tolerance	N/A ±0.03 mm	N/A ±0.05 mm	N/A ±0.05 mm	N/A ±0.05 mm	N/A ±0.05 mm
Array	N/A 3 x 2	N/A 2 x 2	N/A 2 x 2	N/A 3 x 3, Interstitial	N/A 2 x 2
Number of Rows	N/A 3	N/A 2	N/A 2	N/A	N/A
Number of Columns	N/A 2	N/A 2	N/A 2	N/A	N/A
Kelvin Type	N/A false
Overall Socket Footprint Length (L)	N/A 26.16 mm	N/A 26.67 mm	N/A 26.67 mm	N/A 26.16 mm	N/A 26.67 mm
Overall Socket Footprint Width (W)	N/A 19.05 mm
Overall Socket Footprint Height (H/T)	N/A 10.8 mm	N/A 13.46 mm	N/A 13.46 mm	N/A 10.8 mm	N/A 13.46 mm
Socket Style	N/A Clamshell
Mounting	N/A	N/A Through-Hole	N/A Through-Hole	N/A	N/A
Ball Diameter	N/A	N/A 0.23 mm	N/A 0.23 mm	N/A 0.16 mm	N/A 0.25 mm
Ball Diameter Tolerance	N/A
Ball Height	N/A
Ball Height Tolerance (±)	N/A
Ball Size	N/A
Ball Size Tolerance (±)	N/A
Lead Time	N/A 2 to 4 week
Additional Information	N/A Low Profile and Small Footprint Zero-insertion-force Surface Mount Design / Solder-Free	N/A Low Profile and Small Footprint Zero-insertion-force Surface Mount Design / Solder-Free	N/A Low Profile and Small Footprint Zero-insertion-force Surface Mount Design / Solder-Free	N/A Low Profile and Small Footprint Zero-insertion-force Surface Mount Design / Solder-Free	N/A Low Profile and Small Footprint Zero-insertion-force Surface Mount Design / Solder-Free