Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
Burn-In and Test Sockets
- 0.22 mm Pitch and Greater
- Accommodates Package Height Variations
- Non-Magnetic Socket Options Available
- Accurate, Tightly-controlled Package Fit
- Contacts Connect Solder ball to Board Pad
- Optional Heat Sink
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Pitch (mm)
Pitch (in)
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Mounting
Item # |
Item Name |
Package Type |
Number of Package Leads (I/O) |
Pitch |
List Price |
|---|---|---|---|---|---|
| 350SQ 388B6618D /Asset/Socket_BGA.jpg | N/A 388 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 388 | Pitch N/A 1.27 mm0.05 in | $488.47 |
| 350SQ 420B6617 /Asset/Socket_BGA.jpg | N/A 420 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 420 | Pitch N/A 1.27 mm0.05 in | $527.30 |
| 350SQ 420B6618A /Asset/Socket_BGA.jpg | N/A 420 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 420 | Pitch N/A 1.27 mm0.05 in | $527.30 |
| 350SQ 432B6618 /Asset/Socket_BGA.jpg | N/A 432 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 432 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 350SQ 440B6618 /Asset/Socket_BGA.jpg | N/A 340 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 340 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 350SQ 440B6618A /Asset/Socket_BGA.jpg | N/A 440 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 440 | Pitch N/A 1.27 mm0.05 in | $551.59 |
| 350SQ 452B6617 /Asset/Socket_BGA.jpg | N/A 452 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 452 | Pitch N/A 1.27 mm0.05 in | $566.15 |
| 350SQ 456B6617 /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $571.00 |
| 350SQ 456B6618 /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $551.59 |
| 350SQ 456B6618A /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $551.59 |
| 350SQ 456B6618B /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $571.00 |
| 350SQ 456B6618C /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $571.00 |
| 350SQ 456B6618D /Asset/Socket_BGA.jpg | N/A 456 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 456 | Pitch N/A 1.27 mm0.05 in | $571.00 |
| 350SQ 464B6618 /Asset/Socket_BGA.jpg | N/A 464 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 464 | Pitch N/A 1.27 mm0.05 in | $134.41 |
| 350SQ 476B6617 /Asset/Socket_BGA.jpg | N/A 432 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 432 | Pitch N/A 1.27 mm0.05 in | $595.29 |
| 350SQ 492B6617 /Asset/Socket_BGA.jpg | N/A 492 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 492 | Pitch N/A 1.27 mm0.05 in | $614.74 |
| 350SQ 492B6618A /Asset/Socket_BGA.jpg | N/A 492 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 492 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 350SQ 505B6617 /Asset/Socket_BGA.jpg | N/A 505 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 505 | Pitch N/A 1.27 mm0.05 in | $578.13 |
| 350SQ 516B6617 /Asset/Socket_BGA.jpg | N/A 516 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 516 | Pitch N/A 1.27 mm0.05 in | $693.80 |
| 350SQ 560B6617 /Asset/Socket_BGA.jpg | N/A 560 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 560 | Pitch N/A 1.27 mm0.05 in | $641.08 |
| 350SQ 580B6617 /Asset/Socket_BGA.jpg | N/A 580 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 580 | Pitch N/A 1 mm0.039 in | $768.38 |
| 350SQ 580B6618A /Asset/Socket_BGA.jpg | N/A 580 Input/Output (I/O) and 1 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 580 | Pitch N/A 1 mm0.039 in | $666.06 |
| 350SQ 625B6617 /Asset/Socket_BGA.jpg | N/A 625 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 625 | Pitch N/A 1.27 mm0.05 in | $715.48 |
| 350SQ 664B6617 /Asset/Socket_BGA.jpg | N/A 664 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 664 | Pitch N/A 1.27 mm0.05 in | QUOTE |
| 350SQ 664C6617 /Asset/Socket_BGA.jpg | N/A 664 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket | Package Type N/A BGA/CSP | Number of Package Leads (I/O) N/A 664 | Pitch N/A 1.27 mm0.05 in | $760.13 |

