Burn-In and Test Sockets
burn-in-and-test-sockets
Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets
(820)- 0.22 mm Pitch and Greater
- Accommodates Package Height Variations
- Non-Magnetic Socket Options Available
- Accurate, Tightly-controlled Package Fit
- Contacts Connect Solder ball to Board Pad
- Optional Heat Sink
Edge Connectors Sockets
(61)- Independent Contacts
- Pitches of 0.100", 0.150" and 0.156"
- Heavy-Duty for Long Life
- V Slot Guides Insertion of Board
- For Board Thickness of 0.054" to 0.070"
- Optional Mounting Ears
Dual Flat No-Lead (DFN) and Quad Flat No-Lead (QFN) Sockets
(1490) /Asset/QFN-Socket---03724-571.jpg Dual Inline Package (DIP) Sockets
(44)- Top Loading Designs
- High Side Contacts Help Align Package Leads
- Positive Contact Wiping Action
- Low Insertion Force
- Bottom Socket Standoffs Help Board Cleaning
- Various Sizes and I/O
- Unloading Tool Also Available
Flat Pack Sockets
(74)- Open Top and Clam Shell Designs
- Accommodate Standard Carriers
- Rugged Construction
- Wire-Formed Contacts
- Solid Clamping of Device Carrier
- Various Sizes and I/O Available
Gull Wing, Small Outline Integrated Circuit (SOIC), and Small Outline Transistor (SOT) Sockets
(304) /Asset/Socket_Gull_Wing.jpg Lead Chip Carrier (LCC) Sockets with Castellations
(148)- Easy Loading and Unloading
- Positive Contact Wiping Action
- Open Top and Clam Shell Designs
- 0.25 mm and Greater Pitches
- Dual Height Contact Options
Land Grid Array (LGA) Sockets
(129)- 0.22mm Pitch and Greater
- Accommodates Package Height Variations
- Non-Magnetic Socket Options Available
- Accurate, Tightly-controlled Package Fit
- Contacts Connect Land pad to Board Pad
Microwave and Hybrid Sockets
(213)- Standard and Custom Designs
- For Microwave Packages
- For Custom Module Packages
- Optional 50 Ohm Impedance Designs with Matching Board Layouts
- Optional Heat Sinks
- Optional Direct Contact of Device Leads onto Board Traces
Optical Transceiver Sockets
(4)- Contact Pitches of 0.25 mm or Greater
- Openings for the Fiber Optic Connector to Attach to Device during Testing
- ClamShell Lid Design Open Widely for Insertion/Withdrawal
- Floating Covers Accommodate Irregular or Oddly-shaped Devices
Plastic Leaded Chip Carrier (PLCC)/Small Outline J-Lead (SOJ) Sockets
(35)- Top Loading and Clam Shell Styles in a Variety of Pitches
- Wide Contact Area for Reliable Connection and Current-carrying Capacity
- No Device Lead Deformation or Excess Stress on the Device Lead
- Easy Manual or Automatic Loading and Unloading
Single Inline Pin (SIP) Sockets
(63)- Kelvin and Non Kelvin
- Top Loading
- For In-line TO and SIP Packages
- Modified and Custom Sockets Available
- May Accommodate More than One Package
- Fit is Independent of Package Body L, W and H
- Various Pitches Available
Surface Mount Device (SMD) Sockets
(224)- Top Loading and Clam Shell Designs
- Kelvin and Single-Sided Contacts
- Zero Insertion Force Clamshell Designs
- Low Insertion Force Open Top Designs
- Optional Multiple Devices per Socket
- 0.25 mm pitches and Greater
- Distance Between Package Sides with Leads is Defined as the Package Width Dimension
Transistor Outline (TO) Sockets
(183)- Top-Loading and Clam Shell Designs
- Kelvin and Single-Sided Contacts
- Small Size Offers Maximum Board Density
- Package Standoffs Aid Package Removal
- Wide Funnel Entry Guides Package Leads
Zig Zag Sockets
(35)- Burn-in and Test, Top-loading for In-line TO Packages
- Variety of Pitches, Lead Lengths and Diameters
- Modified and Custom Sockets Available, (Kelvin or Double-sided Contact Options)
- Package Body Length, Width and Thickness are Independent of Socket. Sockets Selected Based on Lead Count, Pitch, and JEDEC Reference
- May Accommodate More Than One Package
